METHOD AND APPARATUS OF SYMMETRICALLY CHAMFERING SUBSTRATE

摘要

A method of symmetrically chamfering a substrate includes repeating, at least a plurality of times, the steps of chamfering an edge of the substrate using a chamfering wheel, measuring an asymmetric chamfering deviation (y) of the edge of the substrate which is chamfered, and controlling a relative position of the chamfering wheel with respect to the substrate by a value of a function f(y) of the variable y. It is possible to constantly symmetrically chamfer the edge of the substrate via active response to a change in the chamfering environment without a hardware-based operation of the related art.

主权项

1. A method of symmetrically chamfering a substrate, comprising repeating cycles a plurality of times, each cycle comprising:
chamfering an edge of the substrate using a chamfering wheel; measuring an asymmetric chamfering deviation (y) of the edge of the substrate which is chamfered; and controlling a relative position of the chamfering wheel with respect to a position of the substrate by a value of a predetermined function f(y) of the variable y.