| 摘要 |
A wire rod connection device comprising a retention base provided with a wire rod storage groove having a width capable of storing a plurality of wire rods, a pressure plate located above the retention base, a heater located above the pressure plate and having a heating element, a first drive unit capable of moving the retention base and the pressure plate close to or away from each other, and a second drive unit capable of moving the retention base and the heater close to or apart from each other, wherein the pressure plate moved close to the retention base by the first drive unit is capable of pressing the plurality of wire rods stacked and stored in the wire rod storage groove via solder, while the heater moved close to the retention base by the second drive unit is capable of pressing and heating the plurality of wire rods stacked and stored in the wire rod storage groove via solder through the pressure plate. |
