| 摘要 |
A cyanate resin composition, and a prepreg, a laminated board, a metal foil clad laminated board and a printed circuit board prepared by using same. The cyanate resin composition comprises a cyanate resin (A), an epoxy resin (B) with a formula (I) structure, and a maleimide compound (C). The cyanate resin composition of the present invention, and the prepreg, the laminated board and the metal foil clad laminated board prepared by using the cyanate resin composition have good moisture resistance, heat resistance, flame resistance and reliability, and is suitable for being used as a substrate material for manufacturing a high-density printed circuit board. |
