发明名称 HYDROPHOBIC INORGANIC PARTICLES, RESIN COMPOSITION FOR HEAT DISSIPATION MEMBER, AND ELECTRONIC COMPONENT DEVICE
摘要 These hydrophobic inorganic particles are obtained by modifying the surfaces of inorganic particles with an organic compound/organic compounds, said organic compound/compounds comprising one or more types selected from compounds included in (i) to (v) below. (i) An amine and carboxylic acid as a monobasic acid having a straight chain or branched chain with a carbon number (excluding the carbon in the carboxyl group in the case of the carboxylic acid) of at least eight. (ii) An amine and carboxylic acid as a dibasic acid having a straight chain or branched chain with a carbon number (excluding the carbon in the carboxyl group in the case of the carboxylic acid) of at least six. (iii) An amine and carboxylic acid as a monobasic acid having a straight chain or a branched chain containing a carbon-carbon double bond. (iv) An amine and carboxylic acid as a monobasic acid or a dibasic acid containing an aromatic ring. (v) A phenol compound or alcohol with a carbon number of six.
申请公布号 WO2014192472(A1) 申请公布日期 2014.12.04
申请号 WO2014JP61536 申请日期 2014.04.24
申请人 SUMITOMO BAKELITE CO., LTD. 发明人 MAEDA SHIGEYUKI
分类号 C09C3/08;C08K9/04;C08L101/00;H01L23/29;H01L23/31;H01L23/36 主分类号 C09C3/08
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