| 摘要 |
<p>The present invention relates to a substrate chamfering apparatus using laser. Provided is a substrate chamfering apparatus using laser which radiates a laser beam on a substrate edge portion along a chamfering line for a high-quality chamfering work which is more accurate and results in a smooth cut surface, and uses laser for the chamfering work, thereby forming the chamfering line in a straight line or a curve to variously form chamfering lines of an appropriate shape according to the type and usage of a substrate, further improving substrate strength to lower the defect rate in a manufacturing process, and securing available space due to the chamfering to make various shapes of design.</p> |
