| 摘要 |
PROBLEM TO BE SOLVED: To provide a testing device and a testing method for a semiconductor chip, which can improve quality of an IPM (Intelligent Power Module) and reduce failure cost of the IPM.SOLUTION: Provided is a testing device 100 of a semiconductor chip 20, which can measure overshoot of dynamic avalanche current Iavds of a sense part 32 by providing a sense resistor 6 for detecting a sense current Is of the semiconductor chip 20 having the sense part 33 and a voltage measuring instrument 7 for measuring a voltage generated at the sense resistor 6. A testing method for a semiconductor chip, of measuring existence or non-existence of overshoot of a sense voltage Vs by using the testing device 100 and determining the semiconductor chip 20 having overshoot to be defective can improve quality of an IPM assembled with a non-defective semiconductor chip and reduce failure cost. |
