| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor chip with a thin adhesive layer, capable of miniaturizing a semiconductor device.SOLUTION: The method of manufacturing a semiconductor chip with an adhesive layer comprises: a coating step of applying an adhesive composition containing a solvent onto one surface of a semiconductor wafer having a circuit on the other surface; an adhesive layer forming step of removing the solvent in the adhesive composition to form an adhesive layer; and a cutting step of cutting the semiconductor wafer having the adhesive layer formed thereon to obtain a semiconductor chip with the adhesive layer. The adhesive composition contains (A) a thermoplastic resin, (B) a thermosetting resin, (C) the solvent removable by heating, and an inorganic filler. The content of the inorganic filler is 1-1,000 pts.mass based on 100 pts.mass of the thermoplastic resin (A). |
