Embedded Heat Slug to Enhance Substrate Thermal Conductivity

摘要

An electronic package is fabricated wherein a substrate is provided having three or more layers. A heat slug is embedded completely within the substrate. A die is attached above the substrate. Thermal paths to the heat slug are linked through the ground signal interconnects (traces, vias and planes).

主权项

1. An electronic package comprising:
a substrate having three or more metal layers, comprising a dielectric core layer, a metal layer within said dielectric core layer thermally connected to at least one metal layer on top of said dielectric core layer and to at least one metal layer on bottom of said dielectric core layer; a die attached above said substrate; and a heat slug embedded within said dielectric layer wherein said heat slug has no direct contact to said die and wherein said heat slug is thermally connected to each of said metal layers.