WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

A wiring board 10 includes a lower wiring conductor 1, an upper insulating layer 2 laminated on the lower wiring conductor 1 and having a via hole 5 where a bottom surface is the lower wiring conductor 1, and a via conductor 3 connected to the lower wiring conductor 1 and filling the via hole 5; and the upper insulating layer 2 includes a first resin layer 2a and a second resin layer 2b sequentially laminated on the lower wiring conductor 1, the via hole 5 has an annular groove 5a over a whole circumference of the inner wall in a boundary between both resin layers 2a and 2b, and the via conductor 3 fills the groove 5.

主权项

1. A wiring board comprising:
a lower wiring conductor; an upper insulating layer laminated on the lower wiring conductor and having a via hole where a bottom surface is the lower wiring conductor; and a via conductor connected to the lower wiring conductor and filling the via hole, wherein the upper insulating layer includes at least a first resin layer laminated on the lower wiring conductor and a second resin layer laminated on the first resin layer, the via hole has an annular groove formed by recessing an inner wall of the via hole over a whole circumference of the inner wall in a boundary between the first resin layer and the second resin layer, and the via conductor filling the via hole also fills the groove while invading in the groove.