PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE

摘要

This printed wiring board (100) comprises: an inner layer circuit substrate (101); an insulation layer (103) provided on at least one surface (110) of the inner layer circuit substrate (101); and a terminal (105) provided on at least one surface (110) of the inner layer circuit substrate (101) and embedded in the insulation layer (103). Nitrogen is segregated in the interface (A1) between the insulation layer (103) and the terminal (105).