发明名称 |
PLATING METHOD, PLATING SYSTEM, AND STORAGE MEDIUM |
摘要 |
<p>A plating method can improve adhesivity with a substrate. The plating method of performing a plating process on the substrate includes forming a vacuum-deposited layer 2A on the substrate 2 by performing a vacuum deposition process on the substrate 2; forming an adhesion layer 21 and a catalyst adsorption layer 22 on the vacuum-deposited layer 2A of the substrate 2; and forming a plating layer stacked body 23 having a first plating layer 23a and a second plating layer 23b which function as a barrier film on the catalyst adsorption layer 22 of the substrate 2. By forming the vacuum-deposited layer 2A, a surface of the substrate 2 can be smoothened, so that the vacuum-deposited layer 2A serving as an underlying layer can improve the adhesivity.</p> |
申请公布号 |
KR20140138714(A) |
申请公布日期 |
2014.12.04 |
申请号 |
KR20147025422 |
申请日期 |
2013.02.22 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
MIZUTANI NOBUTAKA;TANAKA TAKASHI;INATOMI YUICHIRO;SAITO YUSUKE;IWASHITA MITSUAKI |
分类号 |
C23C28/02;C23C14/24;C23C16/44;C23C18/18;C23C18/50;H01L21/288 |
主分类号 |
C23C28/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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