| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin multilayer substrate manufacturing method which is excellent in reliability of electrical connection between built-in chip components.SOLUTION: In a resin multilayer substrate manufacturing method, a width Wof a cavity on an opening surface side is wider than a width Wof the cavity on a bottom face side, and a width Wof a chip component is wider than the width Wand narrower than the width W. A height Tof the chip component is smaller than a depth Tof the cavity. In a process of storing the chip component in the cavity, a first principal surface of the chip component and the bottom face of the cavity are opposed to each other and a predetermined clearance is formed between the first principal surface of the chip component and the bottom face of the cavity. Further, a second principal surface of the chip component is located on the opening surface of the cavity or outside the cavity. |
