| 发明名称 |
WAFER BONDING MISALIGNMENT REDUCTION |
| 摘要 |
A method for wafer bonding includes measuring grid distortion for a mated pairing of wafers to be bonded to determine if misalignment exists between the wafers. During processing of subsequent wafers, magnification of one or more lithographic patterns is adjusted to account for the misalignment. The subsequent wafers are bonded with reduced misalignment. |
| 申请公布号 |
US2014356981(A1) |
申请公布日期 |
2014.12.04 |
| 申请号 |
US201313903198 |
申请日期 |
2013.05.28 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
HUBBARD Alex R.;LA TULIPE, JR. Douglas C.;SKORDAS Spyridon;WINSTEL Kevin R. |
| 分类号 |
H01L21/66;H01L23/00 |
主分类号 |
H01L21/66 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for wafer bonding, comprising:
measuring grid distortion for a mated pairing of wafers to be bonded to determine if misalignment exists between the wafers; during processing of subsequent wafers, adjusting magnification of one or more lithographic patterns to account for the misalignment; and bonding the subsequent wafers. |
| 地址 |
Armonk NY US |
