ELECTROPLATING BATHS OF SILVER AND TIN ALLOYS

摘要

Silver and tin alloy electroplating baths include complexing agents which enable the electroplating of either silver rich or tin rich alloys. The silver and tin alloy electroplating baths are substantially free of lead. They may be used to electroplate silver and tin alloys in the manufacture of electronic components such as electrical connectors, finishing layers for metallic substrates, decorative applications and solder bumps.

主权项

1. An electroplating bath comprising one or more sources of silver ions, one or more sources of tin ions, one or more compounds having a formula:
X—S—Y  (I) wherein X and Y may be substituted or unsubstituted phenol groups, HO—R— or —R′S—R″—OH with the proviso that when X and Y are the same they are substituted or unsubstituted phenol groups otherwise X and Y are different and wherein R, R′ and R″ are the same or different and are linear or branched alkylene radicals having 1 to 20 carbon atoms; and one or more compounds having a formula: wherein M is hydrogen, NH4, sodium or potassium and R1 is substituted or unsubstituted, linear or branched (C2-C20)alky, or substituted or unsubstituted (C6-C10)aryl.