| 发明名称 |
Mechanical Debonding Method and System |
| 摘要 |
A mechanical debonding method and system are provided. A mechanical debonding method, used to debond temporary bonding wafers formed by bonding a device wafer and a carrier wafer by an adhesive, includes: obtaining the height position of the adhesive through a thickness measurement apparatus; moving a cutting apparatus to a position between the device wafer and the carrier wafer based on the height position of the adhesive, then removing the adhesive at the edge of the temporary bonding wafers by the cutting apparatus; removing the carrier wafer from the temporary bonding wafers; cleaning the adhesive left on the surface of the device wafer. |
| 申请公布号 |
US2014356988(A1) |
申请公布日期 |
2014.12.04 |
| 申请号 |
US201414253589 |
申请日期 |
2014.04.15 |
| 申请人 |
National Center for Advanced Packaging Co., Ltd. |
发明人 |
Yu Daquan;Jiang Feng |
| 分类号 |
H01L21/67;H01L21/02 |
主分类号 |
H01L21/67 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A mechanical debonding method, used to debond temporary bonding wafers formed by bonding a device wafer and a carrier wafer by an adhesive, comprising:
obtaining the height position of the adhesive through a thickness measurement apparatus; moving a cutting apparatus to a position between the device wafer and the carrier wafer based on the height position of the adhesive, then removing the adhesive at the edge of the temporary bonding wafers by the cutting apparatus; removing the carrier wafer from the temporary bonding wafers; cleaning the adhesive left on the surface of the device wafer. |
| 地址 |
Wuxi City CN |
