发明名称 |
SEMICONDUCTOR LIGHT EMITTING DEVICE |
摘要 |
A semiconductor light emitting device includes: a semiconductor light emitting element including a transparent substrate; a reflective substrate on which the semiconductor light emitting element is mounted; an adhesive layer containing a fluorescent substance, for fixing the semiconductor light emitting element on the reflective substrate; and a sealing member containing a fluorescent substance, for sealing the semiconductor light emitting element. In the semiconductor light emitting device, the adhesive layer has a thickness equal to or smaller than average particle size of the fluorescent substance contained in the sealing member. |
申请公布号 |
US2014353704(A1) |
申请公布日期 |
2014.12.04 |
申请号 |
US201314361216 |
申请日期 |
2013.05.29 |
申请人 |
SHARP KABUSHIKI KAISHA |
发明人 |
Kamikawa Takeshi |
分类号 |
H01L33/50;H01L33/60;H01L33/56 |
主分类号 |
H01L33/50 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor light emitting device, comprising:
a semiconductor light emitting element including a transparent substrate; a substrate on which said semiconductor light emitting element is mounted; an adhesive layer containing a fluorescent substance, for fixing said semiconductor light emitting element on said substrate; and a sealing member containing a fluorescent substance, for sealing said semiconductor light emitting element; wherein said adhesive layer has a thickness equal to or smaller than average particle diameter of said fluorescent substance contained in said sealing member. |
地址 |
Osaka-shi JP |