发明名称 SEMICONDUCTOR LIGHT EMITTING DEVICE
摘要 A semiconductor light emitting device includes: a semiconductor light emitting element including a transparent substrate; a reflective substrate on which the semiconductor light emitting element is mounted; an adhesive layer containing a fluorescent substance, for fixing the semiconductor light emitting element on the reflective substrate; and a sealing member containing a fluorescent substance, for sealing the semiconductor light emitting element. In the semiconductor light emitting device, the adhesive layer has a thickness equal to or smaller than average particle size of the fluorescent substance contained in the sealing member.
申请公布号 US2014353704(A1) 申请公布日期 2014.12.04
申请号 US201314361216 申请日期 2013.05.29
申请人 SHARP KABUSHIKI KAISHA 发明人 Kamikawa Takeshi
分类号 H01L33/50;H01L33/60;H01L33/56 主分类号 H01L33/50
代理机构 代理人
主权项 1. A semiconductor light emitting device, comprising: a semiconductor light emitting element including a transparent substrate; a substrate on which said semiconductor light emitting element is mounted; an adhesive layer containing a fluorescent substance, for fixing said semiconductor light emitting element on said substrate; and a sealing member containing a fluorescent substance, for sealing said semiconductor light emitting element; wherein said adhesive layer has a thickness equal to or smaller than average particle diameter of said fluorescent substance contained in said sealing member.
地址 Osaka-shi JP