COPPER FOIL FOR HIGH-FREQUENCY CIRCUIT, COPPER CLAD LAMINATE SHEET FOR HIGH-FREQUENCY CIRCUIT, PRINTED WIRING BOARD FOR HIGH-FREQUENCY CIRCUIT, COPPER FOIL WITH CARRIER FOR HIGH-FREQUENCY CIRCUIT, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURING PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a copper foil for a high frequency circuit whose transmission loss is excellently suppressed even if used for a high frequency circuit board and in which generation of powder omission on the copper foil surface is excellently suppressed.SOLUTION: Disclosed is a copper foil which forms a ternary-alloy secondary particle layer comprising copper, cobalt and nickel on a primary particle layer after forming the primary particle layer made of copper on the surface of the copper foil. The ratio of a two-dimensional surface area to a three-dimensional surface area in a predetermined region on the roughening treated surface by a laser microscope is 2.0 or more and less than 2.2.