| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device which can inhibit pump out thereby to improve thermal reliability.SOLUTION: A semiconductor device comprises: a heat sink 20; semiconductor modules 30, 31, 32 each having a heat dissipation metal 37 on a rear face; metal plates 40, 41, 42 which are bonded to arrangement regions of the semiconductor modules on the heat sink and each has a linear expansion coefficient closer to a linear expansion coefficient of the heat dissipation metal than a linear expansion coefficient of the heat sink; and a leaf spring 60 for depressing a heat dissipation metal side of the semiconductor module to the metal plate of the heat sink via heat dissipation greases 50, 51, 52.</p> |
