| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability of a through-hole conductor which penetrates through an insulative resin substrate.SOLUTION: A through-hole conductor is formed of a seed layer formed on the inner wall of a through-hole for the through-hole conductor, a laminate electrolytic plating layer formed on the seed layer, and a filler electrolytic plating layer which fills a recess formed of the laminate electrolytic plating layer. Then, the through-hole is closed by the laminate electrolytic plating layer formed of a plurality of laminate electrolytic plating films. |
