| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emitting module which improves heat radiation performance, reduces a number of components, and achieves thickness reduction, and to provide a lighting device.SOLUTION: A light emitting element 22 is placed on a placement surface 211 of a plate-like base member 21 and a translucent element cover 40 covers the light emitting element 22 and holds the base member 21. An end surface 401 of the element cover 40 and a rear surface 212 of the placement surface 211 in the base member 21 are exposed. Thus, the base member 21 and the element cover 40 are directly attached to an attachment surface 121 of a device body 12 in a face-contact manner, and heat emitted by the light emitting element 22 is directly transmitted to the device body 12. Therefore, the structure improves the heat radiation performance, reduces the number of components, and achieves thickness reduction. |
