CONDUCTIVE PARTICLES, METHOD FOR PRODUCING CONDUCTIVE PARTICLES, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide conductive particles in which adhesion between base material particles and conductive layers can be enhanced and which are capable of reducing connection resistance when electrically connecting electrodes.SOLUTION: Conductive particles 1 according to the present invention each comprise a base material particle 2 and a conductive layer 3 disposed on the surface of the base material particle 2. The base material particle 2 has a silanol group on its surface. The conductive layer 3 includes a copper layer. The copper layer is formed using an electroless copper plating solution having a pH of 9 or less, or the conductive layer 3 has a conductive layer different from the copper layer between the base material particle 2 and the copper layer.