| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a cleaning liquid for a semiconductor device capable of highly cleaning contamination caused by fine particle adhesion on a semiconductor substrate polished by polishing solution containing cerium compound particles whose surface potential is positively charged with electricity, with safety and with ease.SOLUTION: After-CMP cleaning liquid used for an after-CMP cleaning step of a semiconductor device performed after a CMP step in semiconductor device manufacturing, contains: (A) water; (B) saccharide exhibiting reductivity under an alkaline atmosphere; and (C) an alkaline component. A pH at 25°C of the after-CMP cleaning liquid is 7 or more.</p> |
