| 摘要 |
An intraneural implant comprises a lead comprising a number of electrode wires, a number of electrodes communicatively coupled to the electrode wires, the electrodes forming an electrode array, and an overmold surrounding the electrode wires and at least a portion of the electrodes, and a blunt dissector tip coupled to the lead to penetrate nerve tissues as the electrode array is implanted. An intraneural implant system comprises a flexible lead. The flexible lead comprises a lead body, an electrode array communicatively coupled to the lead body, a blunt dissector tip to penetrate a nerve bundle as the electrode array is implanted into the nerve bundle, and an implantation tool coupled to the electrode array to implant the electrode array into the nerve bundle. |
