SEMICONDUCTOR DEVICE

摘要

A semiconductor device composed of a plurality of semiconductor modules exhibiting a large current carrying capacity for a semiconductor device as a whole is disclosed. The connection between the plurality of semiconductor modules is conducted by means of optimum construction suited to the semiconductor device. The device comprises a semiconductor module having externally connecting terminals protruding out of a casing, bus bars electrically connecting the specific externally connecting terminals of the plurality of semiconductor modules arranged in parallel with each other, and a semiconductor module case covering and fastening the plurality of semiconductor modules connected with the bus bars. The bus bars and the externally connecting terminals of the semiconductor modules are joined by means of laser welding.

主权项

1. A semiconductor device comprising:
a plurality of semiconductor modules, each having one or more semiconductor chips mounted on an insulated circuit board and contained in a casing, with externally connecting terminals connected to the semiconductor chips or the insulated circuit board protruding from the casing; bus bars electrically connecting specific externally connecting terminals of the plurality of semiconductor modules arranged in parallel; and a semiconductor module case having through-holes for protruding external terminals that are portions of the bus bars, and covering and fastening the plurality of semiconductor modules that are connected by the bus bars; wherein the bus bars and the externally connecting terminals of the semiconductor modules are connected by means of laser welding.