发明名称 |
ELECTRONIC DEVICE |
摘要 |
An electronic device for dissipating heat generated from an electronic component includes a heat dissipation tape affixed on a heat transfer path that receives transferred heat generated from the electronic component. The heat dissipation tape has at least one heat dissipation fin formed by folding back a portion of the heat dissipation tape. |
申请公布号 |
US2014355214(A1) |
申请公布日期 |
2014.12.04 |
申请号 |
US201414289410 |
申请日期 |
2014.05.28 |
申请人 |
Funai Electric Co., Ltd. |
发明人 |
Tamai Ryuichi;Ishida Toshiyuki |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
|
代理人 |
|
主权项 |
1. An electronic device for dissipating heat generated from an electronic component, comprising:
a heat dissipation tape affixed on a heat transfer path that receives transferred heat generated from the electronic component, wherein the heat dissipation tape comprises at least one heat dissipation fin formed by folding back a portion of the heat dissipation tape. |
地址 |
Osaka JP |