| 摘要 |
PROBLEM TO BE SOLVED: To provide a discharge assist type laser hole processing method, hardly causing a crack in a through-hole after processing.SOLUTION: The discharge assist type laser hole processing method is provided for forming the through-hole in an insulation base board by combining laser beam irradiation and a discharge phenomenon between first and second electrodes. The discharge assist type laser hole processing method comprises (1) a step of heating an irradiation area of the insulation base board by irradiating a laser beam and (2) a step of generating discharge in the irradiation area by impressing DC voltage between the first and second electrodes arranged on both sides of the insulation base board, that is, the step by which a charge amount Q(nC) expressed by the product of Eand C falls within a range of 1000 nC-10000 nC, assuming the DC voltage impressed between the first and second electrodes as E(V) and discharge capacity in discharge as C(nF). |
