| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a camera module in which the deterioration of adhesion strength between a component holder and an adhesive agent due to a reduction in a contact area caused by a reduction in size of a component and the deterioration of adhesion strength of the adhesive agent itself due to external stresses are suppressed.SOLUTION: In a camera module 10 including a circuit board 101, a solid state imaging element Sc provided on the circuit board 101, and an optical component Le for guiding light from an object to the solid state imaging element Sc, an adhesion surface of a component holder to be bonded on the circuit board 101, namely a bottom surface 121 of a holder leg 120, is made to have an irregular shape by plasma processing.</p> |
