| 发明名称 |
THERMAL INTERFACE TECHNIQUES AND CONFIGURATIONS |
| 摘要 |
Embodiments of the present disclosure describe thermal interface techniques and configurations. In some embodiments, a thermal interface apparatus may include a flexible container, a plurality of thermally conductive objects disposed within the flexible container, and an attachment member coupled to the flexible container for attaching the thermal interface apparatus to a heat sink. The thermally conductive objects may be movable to rearrange their packing within the flexible container in response to deformation of the flexible container. Other embodiments may be described and/or claimed. |
| 申请公布号 |
US2014354314(A1) |
申请公布日期 |
2014.12.04 |
| 申请号 |
US201313907454 |
申请日期 |
2013.05.31 |
| 申请人 |
Arora Hitesh;Decesare, JR. Lawrence D.;Lofgreen Kelly P.;Lyman Andrew C.;Schroeder Michael A. |
发明人 |
Arora Hitesh;Decesare, JR. Lawrence D.;Lofgreen Kelly P.;Lyman Andrew C.;Schroeder Michael A. |
| 分类号 |
G01R31/28;B23P15/26;F28F3/12 |
主分类号 |
G01R31/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A thermal interface apparatus, comprising:
a flexible container; a plurality of thermally conductive objects disposed within the flexible container such that the thermally conductive objects are movable to rearrange their packing within the flexible container in response to deformation of the flexible container; and an attachment member coupled to the flexible container for attaching the thermal interface apparatus to a heat sink. |
| 地址 |
Chandler AZ US |
