发明名称 |
FORMULATED POLYURETHANE RESIN COMPOSITIONS FOR FLOOD COATING ELECTRONIC CIRCUIT ASSEMBLIES |
摘要 |
Formulated resin systems containing polymeric flood coat compositions are provided herein and characterized by having an initial mix thixotropic index from 1 to 5, and a gel time from 5 to 15 minutes such that when cured the compositions provide a Shore hardness from 15A to 90A, a thickness on horizontal surfaces from 20 mils to 75 mils, and a thickness on vertical surfaces from 4 mils to 20 mils. Electronic circuit assemblies flood coated with such formulated resin systems, and methods for protecting and supporting said assemblies, are also provided. |
申请公布号 |
WO2014194303(A1) |
申请公布日期 |
2014.12.04 |
申请号 |
WO2014US40421 |
申请日期 |
2014.05.31 |
申请人 |
CYTEC INDUSTRIES, INC. |
发明人 |
JORDAN, RICHARD, DAVID, JR.;SCANLON, THOMAS, C., IV |
分类号 |
C09D175/04;C08G18/10;C08G18/24;C08G18/36;C08G18/48;C08G18/76;C08K3/36;H05K3/28 |
主分类号 |
C09D175/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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