<p>A semiconductor wafer polishing device (1) is provided with: a polishing wheel (10); a first driving means (20) that rotationally drives the polishing wheel; a wafer support tool (30); and a second driving means (40) that rotationally drives the wafer support tool. The polishing wheel is provided with a plurality of grindstones (13) on the principal surface that faces the wafer support tool. The wafer support tool supports the semiconductor wafer so that the polishing surface of the semiconductor wafer faces the principal surface of the polishing wheel. Each of the grindstones is formed to radially extend from the center of the polishing wheel and to intersect the polishing surface of the semiconductor wafer. The present invention polishes the surface to be polished of the semiconductor wafer by means of the plurality of grindstones while rotating the polishing wheel and the wafer support tool.</p>
