| 摘要 |
The present invention relates to a semiconductor device capable of self-curing. The semiconductor device includes a semiconductor substrate which has active regions defined by a device isolation layer, word lines which crosses the active regions in a first direction to be extended, and bit lines which crosses the active regions in a second direction different from the first direction to be extended and crosses the word lines. Different polarity voltages are applied to both ends of at least one among the word lines to perform a self-curing process. |
