发明名称 WIRING BOARD
摘要 <p>PROBLEM TO BE SOLVED: To provide a wiring board capable of achieving improvement in insulation reliability.SOLUTION: A wiring board includes a substrate body 20 having grooves 21, and wiring patterns 31 provided in the grooves 21. Since the substrate body 20 further includes convex weir parts 211 provided at an opening peripheral edge of the grooves 21, peaks 212 of the weir parts 211 relatively become high with respect to the top surface 20a of the substrate body 20. Moreover, the weir parts 211 extend along the grooves 21 and have an inclined surface 213 which gradually becomes high as it approaches the opening peripheral edge of the grooves 21.</p>
申请公布号 JP2014225611(A) 申请公布日期 2014.12.04
申请号 JP20130105023 申请日期 2013.05.17
申请人 FUJIKURA LTD 发明人 NAKAMURA KEI
分类号 H05K1/02;H05K3/10;H05K3/22 主分类号 H05K1/02
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