| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor laminate structure which can inhibit warpage of a substrate and inhibit deterioration in basic characteristics caused by increase in heat resistance and heat.SOLUTION: A semiconductor laminate structure of the present invention comprises: a semiconductor substrate; a semiconductor multilayer film arranged on the semiconductor substrate; a strain compensation layer arranged between the semiconductor substrate and the semiconductor multilayer film. The semiconductor multilayer film includes a stacked plurality of paired layers of a layer having first strain and a layer having second strain, in which a sum of the first strain and the second strain is a sum of compression strain or extensional strain and strain of the strain compensation layer has a sign opposite to a sign of the sum of the first strain and the second strain.</p> |
