| 摘要 |
<p>PROBLEM TO BE SOLVED: To manufacture a circuit board of thick film by allowing high speed electrolytic plating by conducting a high electrolytic current.SOLUTION: On the surface 3c of a stainless plate 3a of a clad material 3 metal bonding the stainless plate 3a and a copper plate 3b, a plating resist layer 3d becoming an insulation layer 1b is laminated. Subsequently, electrolytic plating is performed in a plating liquid 5b in an electrolysis tank 5, by using the clad material 3 as a cathod electrode (negative electrode) and a copper plate 5a as an anode electrode. Consequently, a copper plating film 7 becoming a thick film conductive pattern 1a is laminated on the surface 3c of the stainless plate 3a. Thereafter, on the surface of a plating resist layer 3d of the clad material 3 and the copper plating film 7 taken out from the electrolysis tank 5, an insulator layer 9 becoming an insulation layer 1c is laminated as a laminate 11, which is then peeled from the clad material 3. Finally, an insulator layer 13 becoming an insulation layer 1d is laminated on a stripping surface 11a of the laminate 11 thus obtaining a thick film circuit board 1.</p> |
