发明名称 RIGID-FLEXIBLE CIRCUIT INTERCONNECTS
摘要 In an example embodiment, a circuit interconnect includes a first printed circuit board (PCB), a second PCB, a spacer, and an electrically conductive solder joint. The first PCB includes a first electrically conductive pad. The second PCB includes a second electrically conductive pad. The spacer is configured to position the first PCB relative to the second PCB such that a space remains between the first PCB and the second PCB after the first electrically conductive pad and the second electrically conductive pad are conductively connected in a soldering process. The electrically conductive solder joint conductively connects the first electrically conductive pad and the second electrically conductive pad.
申请公布号 US2014355228(A1) 申请公布日期 2014.12.04
申请号 US201414289249 申请日期 2014.05.28
申请人 FINISAR CORPORATION 发明人 Shi Wei
分类号 H05K1/11;H05K1/02 主分类号 H05K1/11
代理机构 代理人
主权项 1. A circuit interconnect comprising: a first printed circuit board (PCB) including a first electrically conductive pad; a second PCB including a second electrically conductive pad; a spacer configured to position the first PCB relative to the second PCB such that a space remains between the first PCB and the second PCB after the first electrically conductive pad and the second electrically conductive pad are conductively connected in a soldering process; and an electrically conductive solder joint conductively connecting the first electrically conductive pad and the second electrically conductive pad.
地址 Sunnyvale CA US