| 发明名称 |
SEMICONDUCTOR DEVICES HAVING SOLDER TERMINALS SPACED APART FROM MOLD LAYERS AND RELATED METHODS |
| 摘要 |
A method of forming an electronic device may include providing a solder structure on a surface of a substrate, and a surface of the solder structure spaced apart from the substrate may be planar. A mold layer may be formed on the surface of the substrate, wherein the mold layer surrounds the solder structure and wherein the planar surface of the solder structure is exposed through the mold layer. After forming the mold layer, the solder structure is heated to form a solder terminal having a curved surface spaced apart from the substrate. Related devices are also discussed. |
| 申请公布号 |
US2014353821(A1) |
申请公布日期 |
2014.12.04 |
| 申请号 |
US201414259275 |
申请日期 |
2014.04.23 |
| 申请人 |
YU Bongken |
发明人 |
YU Bongken |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of forming an electronic device, the method comprising:
providing a solder structure on a surface of a substrate, wherein a surface of the solder structure spaced apart from the substrate is planar; forming a mold layer on the surface of the substrate, wherein the mold layer surrounds the solder structure and wherein the planar surface of the solder structure is exposed through the mold layer; and after forming the mold layer, heating the solder structure to form a solder terminal having a curved surface spaced apart from the substrate. |
| 地址 |
Hwaseong-si KR |
