发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME |
摘要 |
A semiconductor device includes a substrate, a first insulation layer formed on the substrate in a first region, a photon absorption seed layer formed on the first insulation layer in the first region and on the substrate in a second region separate from the first region, and a photon absorption layer formed on the photon absorption seed layer in the first region. The photon absorption seed layer has a particular structure that may assist in reducing dislocation density in a region that includes a photon absorption layer. |
申请公布号 |
US2014353713(A1) |
申请公布日期 |
2014.12.04 |
申请号 |
US201314141547 |
申请日期 |
2013.12.27 |
申请人 |
KUH BONGJIN;KIM KICHUL;KIM JEONGMEUNG;SHIN JOONGHAN;LIM JONGSUNG;CHOI HANMEI |
发明人 |
KUH BONGJIN;KIM KICHUL;KIM JEONGMEUNG;SHIN JOONGHAN;LIM JONGSUNG;CHOI HANMEI |
分类号 |
H01L31/0248;H01L31/18 |
主分类号 |
H01L31/0248 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor device comprising:
a substrate; a first insulation layer formed on the substrate in a first region; a photon absorption seed layer formed on the first insulation layer in the first region and on the substrate in a second region separate from the first region; and a photon absorption layer formed on the photon absorption seed layer in the first region, wherein: the photon absorption seed layer includes a first portion extending in a horizontal direction on the first insulation layer in the first region, a second portion extending in a horizontal direction on the substrate in the second region, and a third portion extending vertically between the first portion and the second portion. |
地址 |
Suwon-si KR |