发明名称 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
摘要 A semiconductor device includes a substrate, a first insulation layer formed on the substrate in a first region, a photon absorption seed layer formed on the first insulation layer in the first region and on the substrate in a second region separate from the first region, and a photon absorption layer formed on the photon absorption seed layer in the first region. The photon absorption seed layer has a particular structure that may assist in reducing dislocation density in a region that includes a photon absorption layer.
申请公布号 US2014353713(A1) 申请公布日期 2014.12.04
申请号 US201314141547 申请日期 2013.12.27
申请人 KUH BONGJIN;KIM KICHUL;KIM JEONGMEUNG;SHIN JOONGHAN;LIM JONGSUNG;CHOI HANMEI 发明人 KUH BONGJIN;KIM KICHUL;KIM JEONGMEUNG;SHIN JOONGHAN;LIM JONGSUNG;CHOI HANMEI
分类号 H01L31/0248;H01L31/18 主分类号 H01L31/0248
代理机构 代理人
主权项 1. A semiconductor device comprising: a substrate; a first insulation layer formed on the substrate in a first region; a photon absorption seed layer formed on the first insulation layer in the first region and on the substrate in a second region separate from the first region; and a photon absorption layer formed on the photon absorption seed layer in the first region, wherein: the photon absorption seed layer includes a first portion extending in a horizontal direction on the first insulation layer in the first region, a second portion extending in a horizontal direction on the substrate in the second region, and a third portion extending vertically between the first portion and the second portion.
地址 Suwon-si KR
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