| 摘要 |
According to one embodiment, a method of manufacturing a display device, includes preparing a first substrate formed such that a first resin layer is formed on a first support substrate, and thereafter a display element portion and a mounting portion are formed above the first resin layer and a protection layer, which extends from an end portion of the first resin layer along the mounting portion onto the first support substrate, is disposed, preparing a second substrate formed such that a second resin layer is formed on a second support substrate, attaching the first substrate and the second substrate, and mounting a flexible printed circuit board, which is in a state in which the flexible printed circuit board is opposed to the protection layer, on the mounting portion. |
| 主权项 |
1. A method of manufacturing a display device, comprising:
preparing a first substrate formed such that a first resin layer with an island shape is formed on a first support substrate, and thereafter a display element portion and a mounting portion are formed above the first resin layer and a protection layer, which extends from an end portion of the first resin layer along the mounting portion onto the first support substrate, is disposed; preparing a second substrate formed such that a second resin layer is formed on a second support substrate; attaching the first substrate and the second substrate; peeling the second support substrate from the second resin layer by radiating a laser beam toward the second substrate; mounting a flexible printed circuit board, which is in a state in which the flexible printed circuit board is opposed to the protection layer, on the mounting portion; and peeling the first support substrate from the first resin layer by radiating a laser beam toward the first substrate. |
