发明名称 Laser Ablation Process for Manufacturing Submounts for Laser Diode and Laser Diode Units
摘要 A method for manufacturing submounts for laser diodes includes the steps of providing a base configured with a ceramic carrier and a metal layer deposited upon the substrate. The method further includes using a pulsed laser operative to generate a plurality of pulses which are selectively trained at predetermined pattern on the metal layer's surface so as to ablate the desired regions of the metal layer to the desired depth. Thereafter the base is divided into a plurality of submounts each supporting a laser diode. The metal layer includes a silver sub-layer deposited upon the ceramic and having a thickness sufficient to effectively facilitate heat dissipation.
申请公布号 US2014353362(A1) 申请公布日期 2014.12.04
申请号 US201313904174 申请日期 2013.05.29
申请人 Ovtchinnikov Alexander;Berishev Igor;Komissarov Alexey;Todorov Svletan;Trubenko Pavel 发明人 Ovtchinnikov Alexander;Berishev Igor;Komissarov Alexey;Todorov Svletan;Trubenko Pavel
分类号 B23K26/36;H05K3/30;H01L23/00;H05K3/00 主分类号 B23K26/36
代理机构 代理人
主权项 1. A method for manufacturing laser diode units each including a submount and laser diode soldered to the submount, the method comprising: providing a base including a ceramic carrier and a metal layer on the carrier; generating a plurality of laser light pulses trained at a predetermined pattern on a metal layer surface, thereby ablating the metal layer to a desired depth; and dicing the ceramic carrier into a plurality of submounts.
地址 Worcester MA US