Temperature Triggering Ejector Mechanism for Lock Pin Soldering Type Component

摘要

A temperature triggering ejector system for lock pin soldering type component is provided. There is provided a temperature triggering ejector system for a lock pin soldering type component, lock pins of said component are fixed in through holes of a circuit board and solder is filled in the through holes after soldering, said system comprising: an ejector that is located at one side of the circuit board that is opposed to said component, and has ejector pins aligned with the through holes of the circuit board and a cylinder that drives the ejector pins; a temperature sensor for sensing the temperature of said solder being heated; a controller for driving the ejector pins of the ejector within a solder melting temperature range based on the temperature sensed by the temperature sensor, to eject the lock pins of said component from said circuit board.

主权项

1. A temperature triggering ejector system for a lock pin soldering component, wherein lock pins of the component are fixed in through holes of a circuit board and solder is filled in the through holes, the ejector system comprising:
an ejector located at one side of the circuit board opposed to the component, wherein the ejector has ejector pins aligned with the through holes of the circuit board and a cylinder that drives the ejector pins; a temperature sensor for sensing a temperature of the solder being heated; and a controller configured to drive the ejector pins of the ejector within a solder melting temperature range based on the temperature sensed by the temperature sensor to eject the lock pins of the component from the circuit board.