| 发明名称 |
ELECTRODE FOR USE WITH A MANUFACTURING APPARATUS FOR DEPOSITING A MATERIAL |
| 摘要 |
An electrode for use with a manufacturing apparatus to deposit a material onto a carrier body and to circulate a coolant through said electrode. The electrode includes a shaft having a first end and a second end spaced from each other. Also included is a head disposed on said second end of said shaft. Further included is a channel defined by an interior surface of said shaft, the channel extending from the first end to a terminal end, wherein the terminal end comprises a non-planar geometry, the channel configured to route the coolant therethrough. Yet further included is a channel coating disposed on said interior surface for maintaining thermal conductivity between said electrode and the coolant, wherein said head has an exterior surface and a head coating is disposed on said exterior surface of said head. |
| 申请公布号 |
US2014353290(A1) |
申请公布日期 |
2014.12.04 |
| 申请号 |
US201414457401 |
申请日期 |
2014.08.12 |
| 申请人 |
Hemlock Semiconductor Corporation |
发明人 |
Dehtiar Max;Hillabrand David;Knapp Theodore;McCoy Keith;Molnar Michael |
| 分类号 |
B23K10/02 |
主分类号 |
B23K10/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electrode for use with a manufacturing apparatus to deposit a material onto a carrier body and to circulate a coolant through said electrode, said electrode comprising:
a shaft having a first end and a second end spaced from each other; a head disposed on said second end of said shaft; a channel defined by an interior surface of said shaft, the channel extending from the first end to a terminal end, wherein the terminal end comprises a non-planar geometry, the channel configured to route the coolant therethrough; and a channel coating disposed on said interior surface for maintaining thermal conductivity between said electrode and the coolant, wherein said head has an exterior surface and a head coating is disposed on said exterior surface of said head. |
| 地址 |
Hemlock MI US |
