| 发明名称 |
METHOD AND COMPOSITION FOR ELECTROLESS NICKEL AND COBALT DEPOSITION |
| 摘要 |
An electroless plating bath composition of matter and corresponding method are described. The plating bath is an aqueous solution including an amino acid having at least one amino moiety and at least one carboxylic acid moiety or a polypeptide thereof, and having a molar ratio of amino moieties to carboxylic acid moieties of 1 or greater, a nickel-containing or a cobalt-containing salt, and a boron-containing reducing agent. The composition of matter is used in a method of electroless nickle-boron and cobalt-boron coating of substrates. |
| 申请公布号 |
US2014353160(A1) |
申请公布日期 |
2014.12.04 |
| 申请号 |
US201313909455 |
申请日期 |
2013.06.04 |
| 申请人 |
SANCHEM, INC. |
发明人 |
Bibber John W. |
| 分类号 |
C25D3/12 |
主分类号 |
C25D3/12 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electroless plating bath composition of matter comprising:
an aqueous solution including: an amino acid having at least one amino moiety and at least one carboxylic acid moiety or a polypeptide thereof, having a molar ratio of amino moieties to carboxylic acid moieties of 1 or greater; a nickel-containing or a cobalt-containing salt; and a boron-containing reducing agent. |
| 地址 |
Chicago IL US |
