WIRING BOARD WITH THROUGH ELECTRODE, METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE

摘要

The objective of the present invention is to provide: a glass interposer having high reliability and excellent electrical characteristics, which has a through electrode that is free from voids, and wherein a wiring line exhibits good adhesion to a glass base; and a method for producing this glass interposer. The method for producing a glass interposer comprises: a step wherein a wiring formation part (3) in a first layer and a land formation part (4) in the first layer are formed within a glass base (1); a step wherein a metal layer (6) is formed only on the front surface of the glass base (1); a step wherein a blind hole (7) is formed only in a portion of the glass base (1), said portion extending from the land formation part (4) in the back surface to the land formation part (4) in the front surface; a step wherein a buried through electrode (8) is formed in the blind hole (7) by electrolytic plating using the metal layer (6); a step wherein a metal layer (14) is formed on the back surface of the glass base (1); and a step wherein the metal layers (6, 14) on the front and back surfaces of the glass base (1) are polished until the glass base (1) is exposed therefrom.