SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SAME

摘要

A semiconductor device (30) is provided with: a backside illumination solid-state imaging element (31), which has a photoelectric conversion unit (21) disposed in a semiconductor substrate (20), and a control unit (22) which is formed on one surface of the semiconductor substrate (20) and includes control elements, the other surface of the semiconductor substrate (20) acting as a light receiving surface; and a cooling element (17) which is disposed on a retaining substrate (10). The top of the control unit in the semiconductor substrate (20) and the top of the cooling element (17) in the retaining substrate (10) are directly bonded so as to face each other.