CLEANING COMPOSITION FOR ETCHING AND REMOVING A THIN LAYER OF SILVER OR MAGNESIUM

摘要

The present invention provides a cleaning composition for removing a silver or magnesium thin film comprising 0.1-60 wt% of nitrate compounds, and 0.05-10 wt% of hydrogen peroxide, and the remaining amount of water. According to the present invention, an etching composition is capable of selectively etching a thin film containing silver or magnesium or an alloy thereof from a multilayered film including silver or magnesium or an alloy thereof. Moreover, the etching composition can be used for cleaning and removing an undesired thin film containing silver or magnesium or an alloy thereof in a process chamber. According to the present invention, the etching composition has the advantage of conveniently cleaning without silver residues after etching; easily controlling a process such as etching rate and/or etching time, etc.; reducing manufacturing equipment costs and manufacturing costs; and preventing environmental pollution.