发明名称 BONDING METHOD, BONDING DEVICE, AND BONDING SYSTEM
摘要 PROBLEM TO BE SOLVED: To prevent natrium from being deposited from a glass substrate.SOLUTION: A bonding method according to an embodiment includes a first holding step, a second holding step, a pressure reducing step, and a bonding step. The first holding step holds a processed substrate. The second holding step holds a glass substrate by placement or electrostatic attraction. The pressure reducing step reduces the pressure in the chamber in which the processed substrate and the glass substrate are stored. The bonding step bonds the processed substrate and the glass substrate by bringing the processed substrate into contact with the glass substrate and pressurizing the processed substrate and the glass substrate. The second holding step switches holding of the glass substrate from holding by placement to holding by electrostatic attraction at least during a prescribed period including a pressure change timing at which the pressure in the chamber changes in the pressure reducing step or during a prescribed period including a pressurizing timing at which the processed substrate and the glass substrate are pressurized in the bonding step.
申请公布号 JP2014225549(A) 申请公布日期 2014.12.04
申请号 JP20130103861 申请日期 2013.05.16
申请人 TOKYO ELECTRON LTD 发明人 OKAWA OSAMU
分类号 H01L21/02;H01L21/683 主分类号 H01L21/02
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