| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus and an electronic component mounting method capable of stably and automatically performing relocation work of receiving pins to improve power saving and high efficiency in process change work.SOLUTION: In a board-bottom receiving method, plural lower receiving pin modules 22 support a board 3 from the bottom thereof. The lower receiving pin module 22 is set upright with a base 23 in contact with a desired position of a lower base 21 having a resin layer 21c formed on the upper face and is fixed at the position by an attraction force of a magnet. When relocating a pin module 22, a pin suction nozzle 34B is attached to a mounting head 8 in a replaceable manner. In a state that the base 23 is adhered to the resin layer 21c, the mounting head 8, which is in the state that the pin suction nozzle 34B sucks the front end portion of the lower receiving pin module 22 to hold the same, is driven to perform a predetermined operation pattern including a shifting operation in a horizontal direction; to thereby peel off the lower receiving pin module 22 with the base 23 being adhered to the resin layer 21c. |
