| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a protective sheet which protects bumps provided in an interposer or a semiconductor chip used for a three-dimensional mounting and also to provide a three-dimensional mounting method using the protective sheet.SOLUTION: A three-dimensional mounting method is provided in which a protective sheet having via holes in positions corresponding to bumps provided in an interposer or a semiconductor chip is used, the protective sheet is sucked to and held on a bonding stage, the bumps of the interposer or the semiconductor chip are positioned to the via holes of the protective sheet to be inserted thereinto and the semiconductor chip held by a bonding tool is mounted on the protective sheet by applying pressure and heating to the interposer or the semiconductor chip.</p> |
