FORMULATED RESIN COMPOSITIONS FOR FLOOD COATING ELECTRONIC CIRCUIT ASSEMBLIES

摘要

Formulated resin systems containing polymeric flood coat compositions are provided herein and characterized by having an initial mix thixotropic index from 1 to 5, and a gel time from 5 to 15 minutes such that when cured the compositions provide a Shore hardness from 15 A to 90 A, a thickness on horizontal surfaces from 20 mils to 75 mils, and a thickness on vertical surfaces from 4 mils to 20 mils. Electronic circuit assemblies flood coated with such formulated resin systems, and methods for protecting and supporting said assemblies, are also provided.

主权项

1. A polyurethane flood coat composition ABCD comprising
a polyisocyanate prepolymer as part A; and in part B, a polyol; a rheology agent C; and a catalyst D, characterized in that when a ratio of part A is mixed with a ratio of part B the mixture provides a thixotropic index from 1 to 5; a gel time from 5 to 15 minutes; and a Shore hardness of 15 A to 90 A when cured.