| 发明名称 |
3D Packages and Methods for Forming the Same |
| 摘要 |
Embodiments of the present disclosure include a semiconductor device and methods of forming a semiconductor device. An embodiment is a method of forming a semiconductor device, the method including bonding a die to a top surface of a first substrate, the die being electrically coupled to the first substrate, and forming a support structure on the top surface of the first substrate, the support structure being physically separated from the die with a top surface of the support structure being coplanar with a top surface of the die. The method further includes performing a sawing process on the first substrate, the sawing process sawing through the support structure. |
| 申请公布号 |
US2014353838(A1) |
申请公布日期 |
2014.12.04 |
| 申请号 |
US201314015703 |
申请日期 |
2013.08.30 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Lin Shih Ting;Yeh Kung-Chen;Lu Szu Wei;Lin Jing-Cheng |
| 分类号 |
H01L23/12;H01L21/56;H01L23/28;H01L23/00;H01L23/48 |
主分类号 |
H01L23/12 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of forming a semiconductor device, the method comprising:
bonding a die to a top surface of a first substrate, the die being electrically coupled to the first substrate; forming a support structure on the top surface of the first substrate, the support structure being physically separated from the die with a top surface of the support structure being coplanar with a top surface of the die; and performing a sawing process on the first substrate, the sawing process sawing through the support structure. |
| 地址 |
Hsin-Chu TW |
